Interconnection process for module assembly and rework
US6574859B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2001 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Jun 6, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interconnection structure and methods for making and detaching the same are presented for column and ball grid array (CGA and BGA) structures by using a transient solder paste on the electronic module side of the interconnection that includes fine metal powder additives to increase the melting point of the solder bond. The metal powder additives change the composition of the solder bond such that the transient melting solder composition does not completely melt at temperatures below +230° C. and detach from the electronic module during subsequent ref lows. A Pb—Sn eutectic with a lower melting point is used on the opposite end of the interconnection structure.In the first method a transient melting solder paste is applied to the I/O pad of an electronic module by means of a screening mask. Interconnect structures are then bonded to the I/O pad.In a second method, solder preforms in a composition of the transient melting solder paste are wetted onto electronic module I/O pads and interconnect columns or balls are then bonded.Detachment of an electronic module from a circuit card can then be performed by heating the circuit card assembly to a temperature above the eutect…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.