Solder ball landpad design to improve laminate performance
US6577004B1 · kind B1 · utility
67Cited by
16References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2000 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Aug 31, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.