Apparatus and method for uniformly depositing thin films over substrates
US6579420B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2001 |
| Grant date | Jun 17, 2003 |
| Priority date | — |
| Expiry date | Feb 9, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/46
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thin film deposition apparatus and method are disclosed in this invention. The apparatus includes a depositing thin-film particle source, a beam-defining aperture between the particle source and the deposited substrate(s), and a substrate holder to rotate the substrate(s) around its center and move the center along a lateral path so that the substrate(s) can scan across the particle beam from one substrate edge to the other edge. The method includes a step of providing a vacuum chamber for containing a thin-film particle source for generating thin-film particles to deposit a thin-film on the substrates. The method further includes a step of containing a substrate holder in the vacuum chamber for holding a plurality of substrates having a thin-film deposition surface of each substrate facing the beam of thin-film particles. The method further includes a step of providing a rotational means for rotating the substrate holder to rotate each of the substrates exposed to the thin-film particles for depositing a thin film thereon. And, the method further includes a step of providing a laterally reciprocal moving means for reciprocally moving said substrate holder for said beam traversin…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.