Use of variable impedance to control coil sputter distribution
US6579426B1 · kind B1 · utility
23Cited by
83References
70Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 1997 |
| Grant date | Jun 17, 2003 |
| Priority date | — |
| Expiry date | May 16, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F29/12
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Capacitances in an impedance-matching box for an RF coil, in a plasma deposition system for depositing a film of sputtered target material on a substrate, can be varied during the deposition process so that the RF coil and substrate heating, and the film deposition, are more uniform due to “time-averaging” of the RF voltage distributions along the RF coil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.