Sandblasting agent, wafer treated with the same, and method of treatment with the same
US6582280B1 · kind B1 · utility
3Cited by
9References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2000 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | Jun 6, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24C11/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A silicon wafer is sand blasted using a sand blasting abrasive material containing a chelating agent which is selected from the group consisting of, for example, the following compounds (1) to (4) and salts thereof:(1) Nitrilotriacetic acid (NTA)(2) Ethylenediaminetetraacetic acid (EDTA)(3) Diethylenediamine-N,N,N″,N″-pentaacetic acid (DTPA)(4) Cyclohexanediaminetetraacetic acid (CyDTA).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.