Teruaki Fukami
9Patents
5h-index
10Co-inventors
52Inventor score
Filing activity: Jan 29, 1996 → Jun 6, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6120353A | Polishing method for semiconductor wafer and polishing pad used therein | Performing Operations; Transporting | 22 | Expired |
| US6306021A | Polishing pad, polishing method, and polishing machine for mirror-polishing semiconductor wafers | Performing Operations; Transporting | 16 | Expired |
| US5821167A | Method of manufacturing semiconductor mirror wafers | Electricity | 14 | Expired |
| US6060396A | Polishing agent used for polishing semiconductor silicon wafers and polishing method using the same | Electricity | 7 | Expired |
| US5866226A | Polishing agent used for polishing semiconductor wafers and polishing method using the same | Emerging Cross-Sectional Technologies | 5 | Expired |
| US5891353A | Polishing agent used for polishing semiconductor wafers and polishing method using the same | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6582280B1 | Sandblasting agent, wafer treated with the same, and method of treatment with the same | Performing Operations; Transporting | 3 | Expired |
| US5792258A | High-frequency induction heater and method of producing semiconductor single crystal using the same | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6884721B2 | Silicon wafer storage water and silicon wafer storage method | Chemistry; Metallurgy | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.