Emissivity-change-free pumping plate kit in a single wafer chamber

US6582522B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Lee Luo · Fremont, US
• Henry Ho · Tokyo, JP
• Shulin Wang · Campbell, US
• Binh Tran · San Jose, US
• Alexander Tam · Union City, US
• Errol Antonio C. Sanchez · Tracy, US
• Xianzhi Tao · Palo Alto, US
• Steven Chen · Fremont, US

Key dates

• Filing date: Mar 2, 2001
• Grant date: Jun 24, 2003
• Expiry date: Mar 2, 2021

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C16/46
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Provided herein is an emissivity-change-free pumping plate kit used in a single wafer chamber. This kit comprises a top open pumping plate, and optionally a skirt and/or a second stage choking plate. The skirt may be installed around the wafer heater, underneath the wafer heater, or along the chamber body inside the chamber. The choking plate is installed downstream of the top open pumping plate along the purge gas flow. Also provided is a method of preventing emissivity change and further providing optimal film thickness uniformity during wafer processing by utilizing such kit in the chamber.