Method and associated apparatus for tilting a substrate upon entry for metal deposition
US6582578B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2000 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | Dec 16, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in the electrochemical plating system by tilting the substrate as it enters the electrolyte solution to limit the trapping or formation of air bubbles in the electrolyte solution between the substrate and the substrate holder. In another aspect, an apparatus is provided for electroplating that comprises a cell, a substrate holder, and an actuator. The actuator can displace the substrate holder assembly in the x and z directions and also tilt the substrate. In another aspect, a method is provided of driving a meniscus formed by electrolyte solution across a surface of a substrate. The method comprises enhancing the interaction between the electrolyte solution meniscus and the surface as the substrate is immersed into the electrolyte solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.