Inspection systems performing two-dimensional imaging with line light spot
US6587193B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 1999 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | May 11, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/94
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer inspection system is described. The wafer is illuminated by an elongated “linear” or “line spot.” The “line spot” is basically an elongated illumination on the wafer surface, such that it covers several pixels aligned to form a line. The linear spot is held stationary with respect to one direction, but the wafer is scanned under it in the other direction. Thus, a two dimensional area is covered and can be imaged. Imaging is preferably performed using a sensor array, such as a line CCD. In the preferred embodiment, two linear spots are used in conjunction with two line CCD's. When inspecting a patterned wafer, the linear spots are projected at complementing 45° angles to the “streets and avenues” axis of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.