Pad tensioning method and system in a bi-directional linear polisher
US6589105B2 · kind B2 · utility
4Cited by
13References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2002 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Apr 18, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism is used to ensure that the tension of the polishing pad is consistently maintained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.