Aluminum deposition shield
US6589407B1 · kind B1 · utility
15Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 1997 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Feb 11, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3441
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An aluminum deposition shield substantially improves transfer of radiated heat from within the vacuum chamber, in comparison to a stainless steel deposition shield. The aluminum deposition shield remains cooler during wafer processing and assists in cooling the chamber components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.