Method for attaching semiconductor components to a substrate using local UV curing of dicing tape
US6589809B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 16, 2001 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Jul 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and a system for attaching semiconductor components to a substrate are provided. In the illustrative embodiment the substrate is a leadframe, and the components are semiconductor dice or packages contained on a component substrate such as a wafer. The method includes the steps of holding and dicing the component substrate using a radiation sensitive tape. The method also includes the steps of providing a component attach system having a radiation curing system, and then performing local curing of the dicing tape during a component attach step using the component attach system. The system includes the component attach system which includes a stepper mechanism for stepping the component substrate, and a component attach mechanism having an ejector pin for pushing the components one at a time from the tape and a pick and place mechanism for placing the components on the substrate. The component attach mechanism also includes a housing having a contact surface for physically engaging the dicing tape, and an opening having an outline matching that of a singulated component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.