Inventor · Boise, ID, US

Michel Koopmans

33Patents
9h-index
19Co-inventors
68Inventor score

Filing activity: Jul 16, 2001 → May 11, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US6847105B2 Bumping technology in stacked die configurations Emerging Cross-Sectional Technologies 92 Expired
US6706557B2 Method of fabricating stacked die configurations utilizing redistribution bond pads Emerging Cross-Sectional Technologies 84 Expired
US6589809B1 Method for attaching semiconductor components to a substrate using local UV curing of dicing tape Electricity 54 Expired
US8937309B2 Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication Electricity 47 Active
US8552567B2 Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication Electricity 32 Active
US10461059B2 Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods Electricity 16 Active
US9287240B2 Stacked semiconductor die assemblies with thermal spacers and associated systems and methods Electricity 12 Active
US9379091B2 Semiconductor die assemblies and semiconductor devices including same Electricity 12 Active
US6911624B2 Component installation, removal, and replacement apparatus and method Electricity 12 Expired
US6845901B2 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece Electricity 8 Expired
US9362143B2 Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages Electricity 7 Active
US9711494B2 Methods of fabricating semiconductor die assemblies Electricity 5 Active
US6943094B2 Method for attaching semiconductor components to a substrate using component attach system having radiation exposure assembly Electricity 4 Expired
US9768147B2 Thermal pads between stacked semiconductor dies and associated systems and methods Electricity 4 Active
US9659917B1 Apparatuses and methods for forming die stacks Electricity 4 Active
US9269700B2 Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods Electricity 4 Active
US9733304B2 Semiconductor device test apparatuses Physics 3 Active
US7347348B2 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece Electricity 3 Expired
US9881910B2 Apparatuses and methods for forming die stacks Electricity 3 Active
US8828798B2 Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication Electricity 3 Active
US10481200B2 Semiconductor device test apparatuses comprising at least one test site having an array of pockets Physics 1 Active
US10062679B2 Apparatuses and methods for forming die stacks Electricity 1 Active
US10126357B2 Methods of testing semiconductor devices comprising a die stack having protruding conductive elements Physics 1 Active
US10153027B1 Memory arrays, and methods of forming memory arrays Electricity 1 Active
US10242726B1 Memory arrays, and methods of forming memory arrays Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.