Method and apparatus for determination of additives in metal plating baths
US6592737B1 · kind B1 · utility
16Cited by
5References
37Claims
0Family size
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Key dates
| Filing date | Oct 17, 2000 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Jul 18, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/4161
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. Plating potentials between the reference and test electrodes are measured and plotted for each of the solution mixtures, and data are extrapolated to determine the concentration of the additive in the sample. A multi-cycle method determines the concentration of both accelerator and suppressor organic additives in Cu plating solution in a single test suite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.