Electrochemically assisted chemical polish
US6592742B2 · kind B2 · utility
20Cited by
69References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2001 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Jul 13, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F7/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of chemically polishing a metal layer on a substrate is provided. The metal layer is chemically polished using an electrochemical polishing (ECP) process. In the ECP process, the substrate is immersed in a chemical polishing solution including a surfactant. The surfactant in the polishing solution covers the surface of the substrate such that only topographic portions of the substrate surface are exposed to the chemical polishing solution. Thereafter, an electrical potential applied to the substrate removes topographic portions of the substrate that are exposed to the polishing solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.