Substrate processing apparatus and method
US6593045B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2001 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Sep 18, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A cassette station, a processing station having a coating unit and a developing unit, and an inspecting station having a film thickness inspecting apparatus and a defect inspecting apparatus are disposed in the direction approximately perpendicular to the direction of the disposition of cassettes of the cassette station in such a manner that the inspecting station is disposed midway between the cassette station and the processing station. In the structure, the inspecting station and the processing station are connected and wafers are automatically transferred among the stations, operations from the substrate process to the inspection can be simplified and the time period necessary therefore can be shortened.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.