Stacked-die package structure
US6593662B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2000 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Jan 12, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stacked-die package structure comprises a carrier, dies, spacers, adhesive layers, conductive lines, a mold compound, and solder balls. The carrier has an upper surface and a back surface opposite to the upper surface. The dies substantially having the same sizes are stacked one by one on the upper surface of the carrier, and a number of bonding pads are located around each die. The spacers are located between two adjacent dies. Adhesive layers located between the spacers, the dies, and the carrier for adhering layers therebetween. The conducting lines are respectively electrically connected between each of the bonding pads of the dies and the carrier. And the mold compound is formed over the upper surface of the carrier, for encapsulating the spacers, the dies and the adhesive layers. A substrate with solder balls or a lead frame having pins is suitable for serving as the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.