Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate
US6596621B1 · kind B1 · utility
30Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 2002 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | May 17, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3463
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a lead-free solder alloy on an electronic substrate. In the method, a metal stack which includes a thick nickel barrier layer and an outer copper layer is then evaporated or plated with silver and tin. Upon heating to an appropriate temperature, the copper, tin and silver form a lead-free tin, silver, copper solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.