Kenneth J. Travis, Jr.
4Patents
3h-index
9Co-inventors
39Inventor score
Filing activity: Apr 30, 1997 → May 17, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6336262B1 | Process of forming a capacitor with multi-level interconnection technology | Emerging Cross-Sectional Technologies | 89 | Expired |
| US6596621B1 | Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate | Electricity | 30 | Expired |
| US5808853A | Capacitor with multi-level interconnection technology | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6555912B1 | Corrosion-resistant electrode structure for integrated circuit decoupling capacitors | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.