Electro-chemical deposition cell for face-up processing of single semiconductor substrates
US6599402B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2002 |
| Grant date | Jul 29, 2003 |
| Priority date | — |
| Expiry date | Jun 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. In another aspect, the apparatus further includes a dual catch-cup system having an electroplating solution catch-cup and a rinse catch-cup. The dual catch-cup system provides separation of the electroplating solution and the rinse solutions during processing and provides re-circulating systems for the different solutions of the electroplating system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.