Thin film attachment to laminate using a dendritic interconnection
US6600224B1 · kind B1 · utility
60Cited by
12References
19Claims
0Family size
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Key dates
| Filing date | Oct 31, 2000 |
| Grant date | Jul 29, 2003 |
| Priority date | — |
| Expiry date | Oct 31, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic interconnection assembly having a thin film bonded to either a glass ceramic or to an organic laminate substrate, and a method for attaching a thin film wiring package to the substrate. Provided is the utilization of adhesives which may be processed at significantly lower temperatures so as to avoid damaging components, the wiring package and interconnection joints. Moreover, pursuant to specific aspects, the joining of the thin film to the substrate may be implemented with the utilization of dendrites.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.