Method of manufacturing circuit with buried strap including a liner
US6605504B1 · kind B1 · utility
10Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2002 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Jun 28, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/0383
Abstract
Semiconductor devices having trenches with buried straps therein preventing lateral out-diffusion of dopant are provided along with methods of fabricating such semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.