Semiconductor chip package having one or more sealing screws
US6608380B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2001 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Oct 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip package comprising a chip with a lid having venting holes hermetically sealed with screws and a manufacturing method thereof are provided. The semiconductor chip package of the present invention comprises a chip such as a central processing unit (CPU) chip generating a large amount of heat; a substrate having upper and lower surfaces, the chip attached to the upper surface of the substrate; external connection terminals extending from the lower surface of the substrate and electrically connected to the chip; a lid attached to the upper surface of the substrate. The lid has a cavity for receiving the chip on a lower surface and venting holes penetrating the lid. The package includes sealing screws for hermetically sealing the venting holes. With the present invention, the venting holes formed through the lid are hermetically sealed without creating any voids or cracks in the sealant as in the prior art.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.