Jung Hwan Chun
11Patents
4h-index
13Co-inventors
57Inventor score
Filing activity: Oct 9, 2001 → Feb 27, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8912662B2 | Wafer-level package and method of manufacturing the same | Electricity | 8 | Active |
| US6608380B2 | Semiconductor chip package having one or more sealing screws | Electricity | 6 | Expired |
| US8952514B2 | Semiconductor package | Electricity | 4 | Active |
| US8222120B2 | Method of dicing wafer using plasma | Electricity | 4 | Active |
| US11114544B2 | Integrated circuit device having fin-type active | Electricity | 0 | Active |
| US8785254B2 | Method of manufacturing high-capacity semiconductor package | Electricity | 0 | Active |
| US11626503B2 | Integrated circuit device having fin-type active | Electricity | 0 | Active |
| US8202744B2 | Wafer through silicon via forming method and equipment therefor | Electricity | 0 | Active |
| US12279449B2 | Semiconductor devices having upper and lower active contacts | Electricity | 0 | Active |
| US9024452B2 | Semiconductor package comprising an interposer and method of manufacturing the same | Electricity | 0 | Active |
| US11955531B2 | Method of forming an integrated circuit device having a contact capping layer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.