Method for making a printed wiring board
US6608757B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2002 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Mar 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/143
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Via holes are formed in an electrically conductive power plane. Photo-imageable dielectric (PID) material is applied to one side of the power plane filling the via holes. The power plane side with no PID material is exposed to light energy to cure the PID material in the via holes. A developer is used to remove any uncured PID material. Signal plane assemblies comprising a conductive signal plane and a dielectric layer are laminated onto the filled power plane forming a two signal and one power plane (2S1P) structure. In another embodiment, the power plane has PID material applied from both sides. A photo-mask is applied to the power plane and the PID material in the via holes is cured with light energy. A developer is used to remove uncured PID material. Signal plane assemblies, as described above, are laminated onto the filled power plane forming a 2S1P structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.