Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates
US6609947B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 30, 2000 |
| Grant date | Aug 26, 2003 |
| Priority date | — |
| Expiry date | Nov 4, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D7/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system for controlling a mechanical or chemical-mechanical planarizing machine comprises a light system, a sensor, and a computer. The light system can have at least a first emitter that generates a first light pulse having a first color and a second emitter that generates a second light pulse having a second color different than the first color. The first and second light pulses reflect from a microelectronic substrate in a manner that creates a first return light pulse corresponding to a reflectance of the first light pulse and a second return light pulse corresponding to a reflectance of the second light pulse. The sensor receives the first return light pulse and the second return light pulse, and the sensor generates a first measured intensity of the first return light pulse and a second measured intensity of the second return light pulse. The computer has a database and a computer readable medium. The database contains a plurality of sets of reference reflectances in which each set has a first reference component defined by a reflectance intensity of the first light pulse and a second reference component defined by a reflectance intensity of the second light pulse from a sel…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.