Method of controlling the formation of metal layers
US6610181B1 · kind B1 · utility
6Cited by
4References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2001 |
| Grant date | Aug 26, 2003 |
| Priority date | — |
| Expiry date | Apr 30, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C26/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention is directed to a method of controlling the formation of metal layers. In one illustrative embodiment, the method comprises depositing a layer of metal above a structure, irradiating at least one area of the layer of metal, and analyzing an x-ray spectrum of x-rays leaving the irradiated area to determine a thickness of the layer of metal. In further embodiments of the present invention, a plurality of areas, and in some cases at least five areas, of the layer of metal are irradiated. The layer of metal may be comprised of, for example, titanium, cobalt, nickel, copper, tantalum, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.