Methods for selective removal of material from wafer alignment marks
US6610610B2 · kind B2 · utility
4Cited by
29References
64Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2001 |
| Grant date | Aug 26, 2003 |
| Priority date | — |
| Expiry date | Aug 30, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process and apparatus for locally removing any material, such as a refractory metal, in particular tungsten, from any desired area of a wafer, such as an alignment mark area of a silicon wafer in process during the formation of integrated circuits thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.