Semiconductor package with singulation crease
US6611047B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2001 |
| Grant date | Aug 26, 2003 |
| Priority date | — |
| Expiry date | Oct 12, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit chip package comprising a lead frame having an integrated circuit die electrically connected thereto. Partially encapsulating the lead frame and the integrated circuit die is a package body. The package body includes the central portion which is circumvented by a peripheral portion defining opposed top and bottom surfaces. Disposed in at least one of the top and bottom surfaces of the peripheral portion of the package body is a singulation crease. The singulation crease, which is formed in the package body during its molding process, is used to provide a stress concentration line which reduces stress along the edge of the chip package and avoids chipping and cracking problems during the punch singulation process used to complete the manufacture of the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.