Patent · US Expired

Bowl, spin, rinse, and dry module, and method for loading a semiconductor wafer into a spin, rinse, and dry module

US6612315B2 · kind B2 · utility

6Cited by
21References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 2, 2001
Grant dateSep 2, 2003
Priority date
Expiry dateJan 24, 2022

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S134/902
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A bowl includes a bottom wall having a generally circular shape. A sidewall extends upwardly from the bottom wall to define a cylindrical chamber. The sidewall has a projection that extends into the cylindrical chamber. The projection has a top surface that defines a step in the cylindrical chamber and a sloped surface that extends between the top surface and an inner surface of the sidewall. The top surface of the projection is sloped slightly downwardly. The sloped surface of the projection is oriented relative to the top surface such that extensions of the top surface and the sloped surface define an angle in a range from about 30 degrees to about 45 degrees. A spin, rinse, and dry module including the bowl and a method for loading a semiconductor wafer into a spin, rinse, and dry module also are described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.