Method for determining the temperature of a semiconductor chip and semiconductor chip with temperature measuring configuration

US6612738B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Peter Beer · Waldshut-Tiengen, DE
• Manfred Dobler · Hersbruck, DE
• Gunnar Krause · Munich, DE

Key dates

• Filing date: Mar 8, 2001
• Grant date: Sep 2, 2003
• Expiry date: Mar 8, 2021

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/30
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

In order to be able to determine precisely a temperature of a semiconductor chip, in particular a semiconductor memory, during active operation, a temperature-dependent diode structure of the chip is connected to four chip terminals using four-conductor connection technology. In this manner, an inexpensive and accurate measuring mechanism is provided for measuring the temperature.