Method and device for arraying substrates and processing apparatus thereof
US6612801B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 24, 2000 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Aug 24, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/138
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate arraying method, a substrate arraying device and a small-sized processing apparatus commonly includes a step of taking 26 sheets of wafers W out of one carrier C at regular intervals of L, a step of taking 26 sheets of wafers W out of another carrier C at regular intervals of L and a step of respectively inserting the 26 sheets of wafers W taken out of the latter carrier C between the 26 sheets of wafers W taken out of the former carrier C to form a group of wafers 100 where 52 sheets of wafers W are arranged at regular intervals of L/2 which is substantially half of the intervals of L. Consequently, it is possible to complete the stable formation of substrates group in a short time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.