Field controlled polishing apparatus
US6612904B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2001 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Dec 27, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D9/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing tool includes a polish pad, a bladder, a fluid, and a flux guide. A bladder containing fluid supports the polishing pad that is positioned adjacent to a surface to be polished. Flux guides positioned along a portion of the bladder direct a field or a magnetic flux to selected locations of the bladder. The method of polishing a surface adjusts the field or the magnetic flux emanating from the flux guides which changes the mechanical properties of the fluid. By adjusting the magnitude of the field or level of magnetic flux flowing from the flux guides independent pressure adjustments occur at selected locations of the bladder that control the polishing profile of the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.