Work piece carrier head for plating and polishing
US6612915B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1999 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Dec 27, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A work piece carrier head can carry a semiconductor wafer during both plating and polishing operations. The carrier head includes a first component secured to a shaft by which the carrier head can be rotated, translated, and moved up and down, a second component connected to the first component and movable by fluid pressure relative to the first component between retracted and extended positions, and a third component connected to the first and second components for up and down movement between wafer loading or unloading and wafer plating or polishing positions. The third carrier head component includes a contact element by which electrical contact with the wafer is provided to permit wafer plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.