Patent · US Expired

Device and method for thermally treating substrates

US6614005B1 · kind B1 · utility

19Cited by

10References

39Claims

0Family size

Assignee

Steag RTP Systems GmbH · DE

Inventors

Heinrich Walk · Allmendingen, DE
Roland Mader · Rüdesheim am Rhein, DE
Werner Blersch · Bußmannshausen, DE
Markus Hauf · Ulm, DE

Key dates

Filing date	Dec 13, 2001
Grant date	Sep 2, 2003
Priority date	—
Expiry date	Dec 13, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH05B3/0047
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The aim of the invention is to provide an economical and homogenous thermal treatment for substrate. To this end, the inventive device and method for thermally treating substrates, especially semiconductor wafers, comprise at least one heating device for heating at least one substrate by electromagnetic radiation. Said heating device comprises at least two arc lamps, the radiation characteristics for each arc lamp being controlled individually, and the electromagnetic radiation of the arc lamps contributing essentially to the power density of the electromagnetic radiation of the heating device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.