Forming viaholes in composition of cyanate, bismaleimide, epoxy resin and unsaturated aromatic glycidyl
US6616984B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2001 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Jul 16, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/901
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process of forming vias in a composition comprising(a) applying a layer of a composition containing (i) a cyanate ester, (ii) a bismaleimide, (iii) a co-curing agent having the structure R1—Ar—R2 wherein Ar is at least one aryl moiety, R1 is at least one unsaturated aliphatic moiety and R2 is at least one glycidyl moiety, (iv) an epoxy resin and, optionally, (v) a free-radical initiator;(b) covering the layer with a mask having windows through which radiation can be transmitted;(c) exposing part of the composition to radiation to at least partially cure it in the exposed areas;(d) removing the non-cured portions of the composition; and(e) completing the cure of the resin compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.