Multi-zone resistive heater
US6617553B2 · kind B2 · utility
38Cited by
3References
62Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2002 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Sep 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heating apparatus including a stage comprising a surface having an area to support a wafer and a body, a shaft coupled to the stage, and a first and a second heating element. The first heating element is disposed within a first plane of the body of the stage. The second heating element is disposed within a second plane of the body of the stage at a greater distance from the surface of the stage than the first heating element, and the second heating element is offset from the first heating element in a plane substantially parallel to at least one of the first plane and the second plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.