Anqing Cui
11Patents
4h-index
29Co-inventors
60Inventor score
Filing activity: Sep 19, 2002 → Jul 20, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6617553B2 | Multi-zone resistive heater | Electricity | 38 | Expired |
| US9312154B2 | CVD apparatus for improved film thickness non-uniformity and particle performance | Electricity | 14 | Active |
| US8618446B2 | Substrate support with substrate heater and symmetric RF return | Electricity | 11 | Active |
| US10407771B2 | Atomic layer deposition chamber with thermal lid | Electricity | 7 | Active |
| US11715667B2 | Thermal process chamber lid with backside pumping | Electricity | 2 | Active |
| US9892941B2 | Multi-zone resistive heater | Electricity | 1 | Active |
| US11335591B2 | Thermal process chamber lid with backside pumping | Electricity | 1 | Active |
| US9202674B2 | Plasma reactor with a ceiling electrode supply conduit having a succession of voltage drop elements | Electricity | 0 | Active |
| US11767590B2 | ALD cycle time reduction using process chamber lid with tunable pumping | Chemistry; Metallurgy | 0 | Active |
| US12054826B2 | ALD cycle time reduction using process chamber lid with tunable pumping | Chemistry; Metallurgy | 0 | Active |
| US12387975B2 | Thermal process chamber lid with backside pumping | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.