Non-plasma in-situ cleaning of processing chambers using static flow methods
US6620256B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2000 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Nov 8, 2020 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF17C2270/05
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
An improved, non-plasma, static method for removing accumulated films and solid residues from interior surfaces of processing chambers used in thermal or plasma CVD treatment processes. The method includes introducing a reactive substance into a processing chamber while adjusting the pressure within the processing chamber to a predetermined level. The flow of the reactive substance into the processing chamber is terminated and the reactive substance is retained in the processing chamber to react with solid residues and form reaction products, following which the reaction products are subsequently removed from the processing chamber. Advantageously, terminating the flow of reactive substance into the processing chamber results in etching action that more effectively utilizes the cleaning agent and generates less hazardous materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.