Dual-beam materials-processing system
US6621044B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2001 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Feb 21, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70358
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Apparatus and method for patterned sequential lateral solidification of a substrate surface, avoiding the need for demagnification to avoid mask damage from fluence sufficient to overcome the threshold for sequential lateral solidification, while using the high throughput of a common stage presenting both 1:1 mask and substrate simultaneously for patterning. The radiation source provides imaging beam and non-imaging beam, each of fluence below the threshold of sequential lateral solidification, but with aggregate fluence above the threshold. The imaging beam path includes a relatively delicate 1:1 mask and 1:1 projection subsystem, with optical elements including a final fold mirror proximate to the substrate surface, put the below-threshold mask pattern on the substrate surface. The non-imaging beam bypasses the delicate elements of imaging beam path, passing through or around the final fold mirror, to impinge on the substrate surface at the same location. Where the radiation patterns of the masked imaging beam and non-imaging beam coincide, their aggregate fluence exceeds the threshold for sequential lateral solidification. The dual selection provides pattern without damage to de…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.