Modular probe card assembly
US6621710B1 · kind B1 · utility
12Cited by
4References
1Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 19, 2002 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Jul 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/20
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A modular probe card assembly comprises a silicon substrate with probes modularly assembled on a main board. At least a socket is installed around silicon substrate and electrically connects to probe needles by a flexible printed wiring film. A plurality of detachable coaxial wires electrically connect sockets with the main board for achieving variability of connecting paths during manufacturing. Thus, the probe card assembly has the effect of adjustable amendment and is suitable for high speed testing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.