Chemical mechanical polishing with friction-based control
US6623334B1 · kind B1 · utility
20Cited by
22References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2000 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | May 2, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus has a polishing surface, a carrier head to press a substrate against the polishing surface with a controllable pressure, a motor to generate relative motion between the polishing surface and the carrier head at a velocity, and a controller. The controller is configured to vary at least one of the pressure and velocity in response to a signal that depends on the friction between the substrate and the polishing surface to maintain a constant torque, frictional force, or coefficient of friction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.