Method and apparatus for fabricating a wafer spacing mask on a substrate support chuck
US6623605B2 · kind B2 · utility
1Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2001 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | Feb 27, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/301
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for fabricating a wafer spacing mask and a substrate support chuck. Such apparatus is a stencil containing a plurality of dual counterbored apertures that is positioned atop the substrate support chuck while material is deposited onto the stencil and through the apertures' openings onto the chuck. Upon completion of the deposition process, the stencil is removed from the workpiece support chuck leaving deposits of the material of various widths but the same heights to form the wafer spacing mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.