Methods for analyzing the effectiveness of wafer backside cleaning
US6624078B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 15, 2002 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | Jul 15, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/34
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for using a monitor substrate to determine effectiveness of a cleaning operation is provided. The method includes selecting a substrate from a lot of substrates and inspecting a surface of the substrate to determine a roughness profile of the substrate. The monitor substrate is then processed through a cleaning operation, and the monitor substrate is patterned with die regions throughout. Each of the die regions has a plurality of areas defining distinct roughness simulations. The method the proceeds to inspecting the monitor substrate at one die region and at one of the plurality of areas in the one die region that most closely resembles the roughness profile of the substrate. The inspecting of the monitor substrate is configured to yield data regarding cleaning performance of the cleaning operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.