Method and apparatus for detecting backside contamination during fabrication of a semiconductor wafer
US6627466B1 · kind B1 · utility
3Cited by
8References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2002 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | May 3, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67259
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of detecting contamination on a backside of a semiconductor wafer includes the steps of positioning the backside of the wafer in contact with a detection surface of a contaminant sensor, and detecting deformation of the detection surface of the contaminant sensor. The contaminant sensor may be incorporated into a fabrication device such as a wafer handling device, or can be utilized in the construction of a stand-alone device. An apparatus for detecting contamination on the backside of a semiconductor wafer is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.