Thin image sensor package
US6627864B1 · kind B1 · utility
61Cited by
32References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 1999 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Nov 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. Of importance, the substrate serves a dual function. In particular, the substrate is the window which covers the active area of the image sensor. Further, the substrate is the platform upon which the image sensor package is fabricated. As a result, the image sensor package is thin, lightweight and inexpensive to manufacture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.