Thermally enhanced stacked die package
US6627990B1 · kind B1 · utility
15Cited by
9References
56Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2003 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Feb 6, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stacked die design, and a method of forming the same, comprising: a substrate having a lower surface and an upper surface; a lower die connected to the substrate; a thermally conductive metal interposer thermally connected to the lower die and/or the substrate; and an upper die thermally connected to the metal interposer. The lower die and the upper die being spaced apart and comprising a stacked die whereby any heat generated by the upper die is transferred to the substrate by the metal interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.