Gas cooled electrostatic pin chuck for vacuum applications
US6628503B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 13, 2001 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Mar 13, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic pin chuck consisting of an annular array of gas inlets, located towards the periphery of the chuck, for providing a uniform distribution of cooling gas to a wafer held by the chuck. This uniform distribution of cooling gas results in a uniform transfer of heat from the wafer to the chuck. Two annular rims positioned towards the outer perimeter of the chuck, and separated by an annular array of vacuum pumpout ports connected through a manifold to a vacuum pump, help to prevent leakages of cooling gas by functioning as gas bearing seals. Varying the annular thickness of the inner and outer rim, vacuum pump pressure, and the space between the wafer and chuck all affect the leakage rate of cooling gas from the chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.