Wafer-less qualification of a processing tool
US6629012B1 · kind B1 · utility
26Cited by
5References
34Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 6, 2000 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Jan 6, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A metbod for perforning a wafer-less qualification of a processing tool includes creating a wafer-less qualification model for the processing tool. Qualification data is generated from the processing tool iiiring a wafer-less qualification process. The qualification data is compared with the wafer-less qualification model. The processig tool is determined to be operating in a predefined state based on the comparison of the qualification data with the wafer-less qualification model.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.