Use of scatterometry for in-situ control of gaseous phase chemical trim process
US6630361B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2001 |
| Grant date | Oct 7, 2003 |
| Priority date | — |
| Expiry date | Jan 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for regulating a gaseous phase chemical trim process is provided. The system includes one or more light sources, each light source directing light to one or more features and/or gratings on a wafer. Light reflected from the features and/or gratings is collected by a measuring system, which processes the collected light. The collected light is indicative of the dimensions achieved at respective portions of the wafer. The measuring system provides trimming related data to a processor that determines the acceptability of the trimming of the respective portions of the wafer. The system also includes one or more trimming devices, each such device corresponding to a portion of the wafer and providing for the trimming thereof. The processor selectively controls the trimming devices to regulate trimming of the portions of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.